Dicing & Grinding Tape
DICING & GRINDING TAPE
- TypeUV／Non-UV
- Thickness0.08–0.20mm
- Wafer6"／8"／12"
- EquipmentDisco / Tokyo Seimitsu
01
SEMICONDUCTOR PACKAGING
Semiconductor Packaging
Materials & Machined Parts
Covering consumables and precision machined parts from front-end wafer dicing, grinding and lamination through back-end packaging, TC bonding and inspection. With materials engineering at our core, we provide stable long-term supply and custom-spec services.
PROCESS POSITION
From wafer intake to packaged shipment,
covering key consumables front to back.
Our product line spans four stages — wafer processing, lamination, packaging and inspection. Each maps to a critical consumable or component need, helping customers cut changeover costs and raise yield.
SEMI ／ Front + Back
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STEP 01Wafer Dicing / GrindingDicing & Grinding Tape · Disco Equipment Consumables
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STEP 02Lamination / ProtectionAnti-Static TPU Film · Heat-Resistant / Protective Tape
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STEP 03Packaging / BondingTC Bonder · DLC-Coated Jigs · Custom Parts
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STEP 04Inspection / CleaningK-Type Thermocouple · Dry-Ice Cleaning System
PRODUCT ITEMS
Nine product items,
each matched to a different process stage.
Below are the main items in this category. Actual specifications, compatible equipment and minimum order quantities are adjusted to your process needs — please contact us.
01–09 ／ Updated 2026
Disco Equipment Parts
DISCO EQUIPMENT PARTS
- CategoryDicing Blades / Spindles / Fixtures
- EquipmentDFD / DAD Series
- ServiceOEM Custom Consumables
- ApplicationWafer Dicing / Grinding
TC Bonder
THERMAL COMPRESSION BONDER
- ApplicationFlip-Chip／Cu-Pillar
- Packaging2.5D / 3D Advanced Packaging
- Accuracy±2μm
- ServiceCustom Builds
DLC Coating Service
DIAMOND-LIKE CARBON COATING
- FeaturesHigh Hardness / Low Friction
- HardnessHV 2000–3000
- ApplicationJigs / Tools / Slide Rails
- Lead Time3–7 working days
Anti-Static TPU Film
ANTI-STATIC TPU FILM
- Surface Resistance10⁶–10⁹ Ω
- Thickness0.05–0.30mm
- ApplicationWafer Protection / Transport
- SubstrateTPU
Heat-Resistant / Protective Tape
HEAT-RESISTANT TAPE
- Temp. Rating200–260°C
- SubstratePI／Kapton／PET
- ApplicationReflow / Wave-Solder Masking
- WidthCustom Cut
Custom Specialty-Material Parts
CUSTOM SPECIALTY PARTS
- MaterialRubber / PEEK / POM / Teflon
- ProcessCNC / Laser / Molding
- BatchPrototype to Mass Production
- Drawings2D / 3D accepted
K-Type Thermocouple
K-TYPE THERMOCOUPLE
- Measuring Range−200 ~ +1200°C
- AccuracyClass 1
- ApplicationReflow / Oven
- LengthCustom Cut
Dry-Ice Cleaning System
DRY ICE CLEANING SYSTEM
- FeaturesNon-Contact / Residue-Free
- MediumCO₂ Dry-Ice Pellets
- ApplicationMolds / PCB / Equipment
- AdvantageEco-Friendly / No Disassembly
APPLICATIONS
Common Use Cases
Below are common customer combinations; actual selection is adjusted to line conditions and spec requirements.
Process Stage
Common Combinations
Typical Customers
01Wafer Dicing / Grinding
Dicing Tape + Disco Blades + Custom Fixtures
Foundry / OSAT
02Wafer Protection / Handling
Anti-Static TPU Film + Heat-Resistant Tape
Wafer Logistics / Storage
03Advanced Packaging
TC Bonder + DLC Jigs + Custom Parts
2.5D / 3D Packaging Houses
04Process Inspection
K-Type Thermocouple + Dry-Ice Cleaning
Process Engineering / QA
01
Three-Stage Inspection
Full lot traceability across raw materials, production and shipment
02
ISO 9001
Quality Management System Certified
03
RoHS／REACH
Compliant with international environmental substance standards
04
24-Hour Response
Shipping plan within a day for urgent orders
NEXT STEP
Need spec consulting or a sample trial?
Share your line details and target specs, and our technical contact will arrange a quote and sample evaluation within 24 hours.